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Freescale Semiconductor Technical Data
MPXV5050VC6T1 Rev 1, 05/2005
High Temperature Accuracy Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXV5050VC6T1 sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer. The MPXV5050VC6T1 piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * * * * * * * 2.5% Maximum Error over 0 to 85C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from Over -40 to +125C Patented Silicon Shear Stress Strain Gauge Durable Thermoplastic (PPS) Surface Mount Package Easy-to-Use Chip Carrier Option Ideal for Automotive and Non-Automotive Applications
MPXV5050VC6T1
INTEGRATED PRESSURE SENSOR -50 to 0 kPa (-7.25 to 0 psi) 0.1 to 4.6 Volts Output SMALL OUTLINE PACKAGE
MPXV5050VC6T1 CASE 482A-01
PIN NUMBER(1)
1 2 3 4 N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C
Typical Applications * Vacuum Pump Monitoring ORDERING INFORMATION
Device Type Options Case No. 482A MPX Series Order No. MPXV5050VC6T1 Packing Options Device Marking
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
Ported Vacuum, Element Axial Port
Tape & Reel MPXV5050VC6T1
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXV5050VC6T1 Sensors Freescale Semiconductor 1
Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 200 -40 to +125 -40 to +125 Units kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2.)
Characteristic Pressure Range Supply Voltage(1) Supply Current Full Scale Output(2) @ VS = 5.0 Volts Full Scale Span(3) @ VS = 5.0 Volts Accuracy(4) Sensitivity Response Time(5) Warm-Up Time(6) Offset Stability(7) Pressure Offset(8) (0 to 85C) (0 to 85C) (Pdiff = 0 kPa) (0 to 85C) Symbol POP VS Io VFSO Min -50 4.75 -- 4.488 Typ -- 5.0 7.0 4.6 Max 0 5.25 10 4.713 Unit kPa Vdc mAdc Vdc
VFSS
--
4.5
--
Vdc
(0 to 85C)
-- V/P tR -- -- Voff
-- -- -- -- -- 0
-- 90 1.0 20 0.5 0.1
2.5 --------0.213
%VFSS mV/kPa ms ms %VFSS Vdc
1. Device is ratiometric within this specified excitation range. 2. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25C due to all sources of errors, including the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 8. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
MPXV5050VC6T1 2 Sensors Freescale Semiconductor
FLUOROSILICONE GEL DIE COAT P1 WIRE BOND LEAD FRAME
DIE
STAINLESS STEEL CAP THERMOPLASTIC CASE
+5 V
Vout Vs IPS 1.0 F 0.01 F GND
OUTPUT
470 pF
P2 DIFFERENTIAL SENSING ELEMENT
DIE BOND
Figure 2. Cross-Sectional Diagram (not to scale)
Figure 3. Typical Application Circuit (Output Source Current Operation)
TRANSFER FUNCTION MPXV5050VC6T1
Transfer Function MPXV5050VC Series 5 Transfer Function: Vout = VS x (0.018 x P + 0.92) (PE x TM x 0.018 x Vs) Vs = 5.0 0.25 vdc PE = 1.25 TM = 1 Temperature = 0 to 85C Output Range (Typ) Offset (Typ) Span Range (Typ) 0
4
Output Voltage (V)
3 MAX 2 MIN 1 TYPICAL
0 -50 -40 -30 Pressure (kPa) -20 -10
Figure 4. Output versus Absolute Pressure Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV5050VC6T1 pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
MPXV5050VC6T1 Sensors Freescale Semiconductor 3
Transfer Function (MPXV5050VC6T1
Nominal Transfer Value: Vout = VS x (0.018 x P + 0.92)
(Pressure Error x Temp Multi x 0.018 x VS) VS = 5.0 0.25 V
Temperature Error Band
MPXV5050V
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C Break Points Temp -40 0 to 85 +125 Multiplier 3 1 3
NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C.
Pressure Error Band
MPXV5050V
Error Limits for Pressure 1.25 Pressure Error (kPa) 1.00 0.75 0 -0.75 -1.00 -1.25 Pressure -50 to 0 kPa Error (Max) 1.25 kPa -50 -40 -30 -20 -10 0 Pressure (in kPa)
MPXV5050VC6T1 4 Sensors Freescale Semiconductor
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.660 16.76
0.100 TYP 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
Figure 5. SOP Footprint (Case 482A)
MPXV5050VC6T1 Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV5050VC6T1 6 Sensors Freescale Semiconductor
NOTES
MPXV5050VC6T1 Sensors Freescale Semiconductor 7
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MPXV5050VC6T1 Rev. 1 05/2005

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